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SOLDER

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[Additional Information]
  • MaterialSn,Ag,Cu,Bi,In
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[NANOTECH Co.,Ltd.]

  • South Korea South Korea
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For quality component proportion, the ideal contents of Sn(stannum) is 60~ 63% in the Sn-Pb type alloy. It has been used mainly for electric and electronic equipment, but due to negative effect to human body and global concern for environment-friendly policy, the use of Pb (lead) is restricted.

NANOTECH Co., Ltd supplies environment-friendly products of high reliability and workability. We promise to do our best for our customers based on our experience and expertise about problems that may arise when applying pb-free solder.

Alloy seriesAlloy compositionsMelting points (℃)BARWIREFlux containPaste
SolidusLiquidus
Sn
Sn 232  
Sn-Ag
Sn-3.5Ag 221
Sn-3.0Ag 221 222    
Sn-Ag-Cu
Sn-3.5Ag-0.55Cu 217
220


Sn-3.0Ag-0.5Cu 217
220
Sn-Ag-Cu-Bi
Sn-1.5Ag-0.85Cu-2.0Bi 210
223

Sn-2.5Ag-0.5Cu-1.0Bi 214
219
Sn-58Bi 138      
Sn-Cu
Sn-0.55Cu
226
 
Sn-0.55-0.3Ag 217
226  
Sn-5.0Cu 227
358    
Sn-3.0Cu-0.3Ag 217
312      
Sn-Ag-Bi-in Sn-3.5Ag-0.5Bi-3.0in
193
216
   
Sn-3.5Ag-0.5Bi-4.0in 192 211    
Sn-3.5Ag-0.5Bi-8.0in 177 208    
Sn-Zn Sn-8.0Zn-3.0Bi 187 197      

In the case of Pb Free Solder in which Tin is contained over 90%, the melting point is lowered, and a little proportion of Ag (Silver), Cu (Copper), In (Indium), and Zn (Zinc), considering their mechanical property is added.
As Pb Free is about 15% lower than Sn-Pb Solder in Wettability and Spreadability, the soldering rate drops